The plastic high-low temperature impact test chamber is easy to operate, but some electronic components sometimes have some faults. The fault migration phenomenon is generally divided into three categories: ion migration, electromigration and stress migration.
Plastic high and low temperature impact test box function:
1. It can automatically preheat in advance, pre-cool standby, and select the starting position in the scheduled start-up time control. It starts to cycle or impact from high temperature or low temperature, and has the functions of setting cycle number and automatic defrost.
2, with automatic, high-precision system loop, any machine action, completely locked by PLC, high temperature control accuracy, all using PID automatic calculus control
3. The air outlet and return air port sensor detection control, the wind direction gate mechanism switching time is completed within 10 seconds, and the thermal shock temperature recovery time is completed within 5 minutes.
Plastic seal high and low temperature impact test chamber failure phenomenon normal:
1. An integrated circuit chip and a component thereof in which a large number of electronic components are integrated on a silicon wafer are connected by wires to form a circuit. Since aluminum and aluminum alloys are inexpensive and have a simple processing process, they are generally used as metal wires of integrated circuits.
2. From the beginning of the integrated circuit plastic sealing process, the moisture will cause corrosion of the aluminum metal wire through the penetration of the epoxy resin, which will open the way, which becomes the most headache problem in quality engineering. Although various efforts have been made to improve product quality through various improvements including the use of different epoxy materials, improved molding technology, and improvement of non-reactive plastic film, with the development of miniaturized semiconductor electronic devices, plastic-sealed aluminum metal wires are corroded. The problem is still a very important technical issue in the electronics industry.
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